Senior Packaging Engineer

IC Resources

Join IC Resources as a Senior Packaging Engineer, focusing on TSV, RDL, and wafer-level packaging processes while tackling integration challenges.

Last checked on June 17, 2026. We may earn a commission when you click through.

If you're an expert in semiconductor packaging looking for a new challenge, this opportunity at IC Resources could be a perfect fit.

✓ Engaging work environment with innovative projects ✓ Opportunity to work with cutting-edge technology ✓ Hybrid work format for better work-life balance

Senior Packaging Engineer

IC Resources

Updated 2 days ago

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Newport Hybrid

If you're an expert in semiconductor packaging looking for a new challenge, this opportunity at IC Resources could be a perfect fit.

About this role

Join IC Resources as a Senior Packaging Engineer, focusing on TSV, RDL, and wafer-level packaging processes while tackling integration challenges.

About the Company

IC Resources is a leading recruitment agency specialising in the technology sector, connecting top talent with innovative companies.

Key Highlights

✓ Expertise in TSV, RDL, and wafer-level packaging processes
✓ Focus on electrical, thermal, and system-level integration
✓ Define interconnect schemes including flip chip and hybrid bonding
✓ Work in a hybrid format in Newport

💡 Honest Take: This role is best suited for experienced engineers with a understanding of packaging technologies; less experienced candidates may find it challenging.

Pros

✓ Engaging work environment with innovative projects
✓ Opportunity to work with cutting-edge technology
✓ Hybrid work format for better work-life balance

Cons

✗ High expectations may lead to significant pressure
✗ Requires extensive experience in specific technologies
✗ Not suitable for entry-level candidates

Best For: This role is for experienced engineers with a background in semiconductor packaging looking to tackle complex integration challenges.

Watch Out: Candidates should be prepared for a demanding role that expects a high level of expertise and responsibility.

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What Customers Say

Feedback from employees highlights a supportive environment but notes the high demands placed on engineers.

Expert Review

The position of Senior Packaging Engineer at IC Resources requires deep knowledge of TSV, RDL, and wafer-level packaging processes. This is a senior role, demanding substantial experience in tackling electrical and thermal integration challenges. Successful candidates will define interconnect schemes, including flip chip and hybrid bonding, which are critical for modern semiconductor applications.

Working in Newport, this role offers a hybrid format, balancing remote work with the need for collaboration on site. This flexibility can enhance job satisfaction, but potential applicants should be aware of the high expectations set by the role. It's a challenging position aimed primarily at those with a proven track record in advanced packaging technologies.

Our editorial team notes that IC Resources has a strong reputation for connecting skilled professionals with leading companies in the tech sector. This opportunity provides a platform to work with technologies, but it's not suitable for those without significant experience. Interested candidates can find more details on the official site: IC Resources.